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GRM155C71A105KE11D
Category: Multilayer Ceramic Capacitors, No CategoryMurata |
Murata | 0402 1 uF 10 V ±10% Tolerance X7S Multilayer Ceramic Chip Capacitor
Packaging: CUTT
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HMC4623LP3ETR
Category: No CategoryAnalog Devices, Inc. |
Analog Devices, Inc. | HMC4623LP3ETR
Packaging: N/A
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XMC1302T038X0064ABXUMA1
Category: ARM Microcontrollers, MCUsInfineon |
Infineon | 32-bit Microcontrollers with ARM® Cortex®-M0 with focus on low-cost embedded control applications.
Packaging: TAP
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R5F5631BDDFC#V0
Category: 32 Bit MicrocontrollersRenesas Electronics |
Renesas Electronics | The RX631 Group 32-bit microcontrollers are capable of operating at up to 100 MHz. The built-in flash is capable of accessing with no wait, and at 100 MHz high-performance processing of 165 DMIPS (Dhrystone MIPS) is realized. A broad memory lineup from 2 MB to 256 KB built-in Flash (+ ROM less) to 256 KB to 64 KB built-in RAM is available to match the scale of your system. Furthermore, all products also contain 32 KB of built-in flash memory for data storage. An abundant selection of packages is also available, from 48 to 177 pins.The RX631/RX63N Series has an extremely comprehensive set of built-in functions, as shown below.1) Up to 21 channels of 12-bit A/D converter and up to 2 channels of D/A converter.2) High-function timer and pulse output functions which make PWM output for motor control possible.3) Independent watchdog timer and CRC function for supporting the home appliance safety standard (IEC 60730) for Europe.4) Abundant communication functions, such as SCI, RSPI, and I2C.1) Connectivity.The RX63N and the RX631 have built-in USB 2.0. full-speed (Function/Host/OTG) functionality, and CAN can be selected as an option. There are also RX631 products that have two built-in USB channels, while still having a low pin count. The RX63N has an Ethernet controller which is suitable for networking equipment. Since the RX631 and the RX63N have 192 KB/256 KB large-capacity on-chip RAM, which can be used for buffering a variety of communication functions, they are also suitable for gateway devices such as HEMS and BEMS and industrial networking equipment.2) Sensing by CMOS camera, and image display.The RX631 has a built-in parallel data capture unit (PDC) that can connect to a CMOS camera module. The PDC can capture images from the CMOS camera for simple image sensor applications such as a motion detector or barcode reader. Furthermore, by using the built-in USB or ExDMAC of the RX631, the entire process from image capture to display can be performed using a single chip.3) Security.The RX63N and the RX631 have a built-in data encryption unit (DEU) that processes AES encryption/decryption by hardware without putting a load on the CPU, making them suitable for devices that handle private information or require security.
Packaging: TRY
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ATMEGA168PA-AUR
Category: MCUsMicrochip Technology |
Microchip Technology | MCU 8-bit AVR RISC 16KB Flash 2.5V/3.3V/5V 32-Pin TQFP T/R
Packaging: N/A
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GCM32ER70J476KE19L
Category: Multilayer Ceramic Capacitors, No CategoryMurata |
Murata | 1210 47 uF 6.3V ±10% Tolerance X7R SMT Multilayer Ceramic Capacitor
Packaging: REEL
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GCM31CR70J226KE23L
Category: Multilayer Ceramic Capacitors, No Category, SMD MLCC Multilayer Ceramic CapacitorsMurata |
Murata | N/A
Packaging: TR
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C2012X7S0J226M125AC
Category: Multilayer Ceramic Capacitors, No Category, SMD MLCC Multilayer Ceramic CapacitorsTDK |
TDK | N/A
Packaging: TR
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KSZ9031RNXIC-TR
Category: Ethernet, PHYMicrochip |
Microchip | The KSZ9031RNX is a completely integrated triple-speed (10Base-T/100Base-TX/1000Base-T) Ethernet physicallayer transceiver for transmission and reception of data on standard CAT-5 unshielded twisted pair (UTP) cable. The KSZ9031RNX provides the reduced gigabit media independent interface (RGMII) for direct connection to RGMII MACs in gigabit Ethernet processors and switches for data transfer at 10/100/1000Mbps. The KSZ9031RNX reduces board cost and simplifies board layout by using on-chip termination resistors for the four differential pairs and by integrating an LDO controller to drive a low-cost MOSFET to supply the 1.2V core. The KSZ9031RNX offers diagnostic features to facilitate system bring-up and debugging in production testing and in product deployment. Parametric NAND tree support enables fault detection between KSZ9031 I/Os and the board. The LinkMD® TDR-based cable diagnostic identifies faulty copper cabling. Remote and local loopback functions verify analog and digital data paths.
Packaging: TAP
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RX8130CE:B0
Category: Integrated Circuits, Real Time ClocksEpson |
Epson | Real Time Clock Serial Clock/Calendar/Alarm/Timer/Interrupt 10-Pin T/R
Packaging: N/A
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PIC16F1503T-I/SL
Category: MCUsMicrochip Technology |
Microchip Technology | MCU 8-bit PIC RISC 3.5KB Flash 2.5V/3.3V/5V Automotive AEC-Q100 14-Pin SOIC N T/R
Packaging: N/A
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NCV4274ADT50RKG
Category: LDO Voltage Regulators, Linear Regulatorsonsemi |
onsemi | The NCV4274 and NCV4274A are precision micro-power voltage regulators with output current capability of 400 mA available in the SOT-223, DPAK and D2PAK packages.The output voltage 8.5V, 5.0V, 3.3V or 2.5V are accurate within ±2% or ±4% depending on the version, with a maximum dropout voltage of 0.5V with an input up to 40 V.Low Quiescent Current is a feature drawing only 150 µA with a 1 mA load.This part is ideal for automotive and all battery operated microprocessor equipment.The regulator is protected against reverse battery, short circuit, thermal overload conditions and can withstand load dump transients making it suitable for use in automotive environments.
Packaging: TR
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TJA1042T/3/CM,118
Category: CAN Transceivers, Controller Area NetworkNXP Semiconductors |
NXP Semiconductors | CAN 5Mbps Standby 5V Automotive AEC-Q100 8-Pin SO T/R
Packaging: N/A
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IPD50P04P4L11ATMA1
Category: MOSFETsInfineon Technologies |
Infineon Technologies | Trans MOSFET P-CH 40V 50A 3-Pin(2+Tab) DPAK T/R Automotive AEC-Q101
Packaging: N/A
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IRF7342TRPBF-EL
Category: MOSFET ArraysInfineon |
Infineon | Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. The SO-8 has been modified through a customized lead frame for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
Packaging: BKN
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LL4148-GS08
Category: Rectifiers, Small Signal Switching Diodes, SwitchingVishay |
Vishay | N/A
Packaging: TR
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VB30200C-E3/8W
Category: Rectifiers, Semiconductors / Active Components, TVS DiodesVishay |
Vishay | VX30200C Series 200 V 15 A (x2) Dual Trench MOS Barrier Schottky Diode -TO-263AB
Packaging: REEL
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RX8130CE:B
Category: Integrated Circuits, Real Time ClocksEpson |
Epson | Real Time Clock Module
Packaging: N/A
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A3981KLPTR-T
Category: Motor Controller and Driver ICsAllegro MicroSystems |
Allegro MicroSystems | Dual Full Bridge Motor Driver Automotive AEC-Q100 28-Pin TSSOP EP T/R
Packaging: N/A
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AD8602DRZ
Category: Op Amps, Operational AmplifiersAnalog Devices, Inc. |
Analog Devices, Inc. | Op Amp Dual Precision Amplifier R-R I/O 5.5V 8-Pin SOIC N Tube
Packaging: N/A
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