MARKET REPORT Q1 2026

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LEAD TIMES

We cover the current lead times and pricing trends for Analog, Power, Passive, Memory, Logic & Digital, and Electromechanical components.

Factory Lines

Open Market

Products Manufacturer LT Prognosis Pricing Availability Pricing
HBM SK Hynix 52+ icon arrow up icon arrow up icon arrow down icon arrow up
Samsung 52+ icon arrow up icon arrow up icon arrow down icon arrow up
IGBT’s STM 14-20 icon arrow up icon arrow double icon arrow double icon arrow double
Littelfuse 15-60 icon arrow double icon arrow double icon arrow double icon arrow double
Capacitors EATON 10-20 icon arrow down icon arrow double icon arrow double icon arrow double
Vishay 12-14 icon arrow double icon arrow double icon arrow double icon arrow double
Memory Modules Kingston 6-12 icon arrow up icon arrow up icon arrow down icon arrow up
ADATA 26-52 icon arrow up icon arrow up icon arrow down icon arrow up
8 Bit MCU Renesas 14-18 icon arrow double icon arrow double icon arrow double icon arrow double
NXP 16-39 icon arrow up icon arrow double icon arrow double icon arrow double
Relays Infineon 40-52 icon arrow double icon arrow up icon arrow double icon arrow up
TE Connectivity 12-14 icon arrow double icon arrow double icon arrow double icon arrow double

Factory Lines

Open Market

Products Manufacturer LT Prognosis Pricing Availability Pricing
HBM SK Hynix 52+ icon arrow up icon arrow up icon arrow down icon arrow up
Samsung 52+ icon arrow up icon arrow up icon arrow down icon arrow up
IGBT’s STM 14-20 icon arrow up icon arrow double icon arrow double icon arrow double
Littelfuse 15-60 icon arrow double icon arrow double icon arrow double icon arrow double
Capacitors EATON 10-20 icon arrow down icon arrow double icon arrow double icon arrow double
Vishay 12-14 icon arrow double icon arrow double icon arrow double icon arrow double
Memory Modules Kingston 6-12 icon arrow up icon arrow up icon arrow down icon arrow up
ADATA 26-52 icon arrow up icon arrow up icon arrow down icon arrow up
8 Bit MCU Renesas 14-18 icon arrow double icon arrow double icon arrow double icon arrow double
NXP 16-39 icon arrow up icon arrow double icon arrow double icon arrow double
Relays Infineon 40-52 icon arrow double icon arrow up icon arrow double icon arrow up
TE Connectivity 12-14 icon arrow double icon arrow double icon arrow double icon arrow double

END-OF-LIFE REPORTS

We highlight the EOL components from major brands, helping companies manage obsolescence and plan for replacements.

Manufacturer Part EOL Replacement
Analog Devices ADP2443 Jul 2026 ADI-recommended buck regulator alternatives
Infineon IR2110 Feb 2026 IRS2110S / newer gate drivers
Vishay BC327 Jan 2026 BC807 / newer small-signal BJTs
Texas Instruments TPS54560 Jan 2026 TPS54561 / newer TI buck regulators
NXP PCA9555 Jan 2026 PCA9535 / newer GPIO expanders
Renesas R5F100LGAFB Feb 2026 RL78/G23 MCU family
Manufacturer Part EOL Replacement
Analog Devices ADP2443 Jul 2026 ADI-recommended buck regulator alternatives
Infineon IR2110 Feb 2026 IRS2110S / newer gate drivers
Vishay BC327 Jan 2026 BC807 / newer small-signal BJTs
Texas Instruments TPS54560 Jan 2026 TPS54561 / newer TI buck regulators
NXP PCA9555 Jan 2026 PCA9535 / newer GPIO expanders
Renesas R5F100LGAFB Feb 2026 RL78/G23 MCU family

TEST & FAILURE RATES

In Q1 2025, 79.3% of tested components met quality standards, while 12.5% required further evaluation, and 8.2% were deemed unacceptable.
While most components passed, nearly 1 in 5 required further inspection or were rejected, highlighting ongoing supply chain risks.

By Device Type

Pie chart illustrating Q4 2025 component test exposure and failure rates: diodes and transistors represent the largest share, followed by MOSFETs; FPGAs and logic ICs show moderate exposure, while memory, MCUs, RF, and power management devices account for smaller but ongoing portions across industrial and communications systems.

Top 10 Component Types by Failure Rate

1. System on a Chip (SoC)
2. CPU
3. Module
4. Regulator
5. Synthesizer
6. Inductor
7. Relay
8. Converter
9. Bus
10. Clock Generator

 

This ranking is determined by the proportion of failed results compared to the total units tested in each category. While some failures stem from aging or mishandling, others could indicate more serious quality issues or potential counterfeit threats

EARNINGS RECAP

This report summarizes the latest earnings results from the biggest brands in electronic components, highlighting key trends and financial insights.

AUTOMOTIVE

General Motors

  • Revenue: $48.59 B (0.3% YoY)
  • Net income: $1.33 B
  • Net Profit Margin: 2.7%

Ford Motor Company

  • Revenue: $50.5 B (+9% YoY)
  • Net income: $2.4 B
  • Net Profit Margin: 4.8%

Toyota

  • Revenue: $93.1 B (+2.9% YoY)
  • Net income: $16.5 B
  • Net Profit Margin: 17.7%

PRODUCT UPDATES

Integrated Circuits

Texas Instruments, ADI, and NXP prioritize analog/power ICs and fab upgrades, securing automotive windows; lead-time pressure persists, with logic/programmable ICs easier to source than memory and passive lines.

Maxim Integrated launches extended automotive-qualified ICs, TI extends industrial portfolios, and ADI offers long-term allocation agreements for OEMs to secure critical IC supply.

FPGA

AMD/Xilinx and Intel segment supply: commodity families stable, but UltraScale+ and automotive-grade face long allocations; OEMs encouraged toward early commitments and partner boards to secure FPGA capacity.

Lattice Semiconductor provides low-power automotive FPGAs, AMD and Xilinx prioritize hyperscaler/telecom allocations, creating a two-tier supply between commodity and high-end SKUs.

Passives

Murata, TDK, and Yageo expand high-value dielectric and MLCC production, prioritizing automotive/industrial allocations; Murata begins new 0402 47µF MLCC runs, reinforcing constrained specialty product availability.

KEMET adds automotive capacitor production, Murata and TDK reinforce wafer capacity, while OEMs adopt multi-vendor sourcing and blanket purchase strategies to manage lead-time risks.

MANUFACTURER UPDATES

SK Hynix

SK hynix has completed development of HBM4 preparing for mass production of this next-generation memory product aimed at ultra-high-performance AI applications.

Samsung

Samsung has reduced the price of its 2nm wafers to $20,000, undercutting TSMC’s $30,000 price by 33%, to ensure utilization of its 2nm production capacity amid heightened.

Micron

Micron has projected higher-than-expected revenue for Q1 2026, driven by growing demand for its high-bandwidth memory (HBM) products amid the global AI boom.

Intel

Intel has approached TSMC to explore potential investments or partnerships, aiming to secure external investments amid ongoing challenges in the competitive chip industry.

Customer Challenges – ASC Solutions
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