Market Report Q2 2025
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LEAD TIMES
We cover the current lead times and pricing trends for Analog, Power, Passive, Memory, Logic & Digital, and Electromechanical components.
Factory Lines |
Open Market |
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| Products | Manufacturer | LT | Prognosis | Pricing | Availability | Pricing |
| Sensors | Vishay | 24-52 |  |
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| Onsemi | 18-52 | |
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| IGBT’s | Littelfuse | 27-60 | |
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| Microchip | 20-26 | |
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| Capacitors | Kyocera | 14-16 | |
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| ELNA | 30-40 |  |
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| Memory Modules | Centon | 6-8 | |
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| SMART Modular | 12-18 | |
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| 8 Bit MCU | Infineon | 10-26 | |
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| NXP | 13-39 | |
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| Relays | American Zettler | 16-30 | |
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| Infineon | 40-52 | |
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Factory Lines |
Open Market |
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|---|---|---|---|---|---|---|
| Products | Manufacturer | LT | Prognosis | Pricing | Availability | Pricing |
| Sensors | Vishay | 24-52 | |
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| Onsemi | 18-52 | |
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| IGBT’s | Littelfuse | 27-60 | |
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| Microchip | 20-26 | |
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| Capacitors | Kyocera | 14-16 | |
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| ELNA | 30-40 | |
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| Memory Modules | Centon | 6-8 | |
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| SMART Modular | 12-18 | |
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| 8 Bit MCU | Infineon | 10-26 | |
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| NXP | 13-39 | |
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| Relays | American Zettler | 16-30 | |
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| Infineon | 40-52 | |
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END-OF-LIFE REPORTS
We highlight the EOL components from major brands, helping companies manage obsolescence and plan for replacements.
| Manufacturer | Part | Info |
| Vishay | Si2315BDS | Last Time Buy (LTB) date of February 28, 2025. |
| Allen-Bradley | RSLogix 5 Software | Final Lifecycle Phase on December 31, 2025. |
| Siemens | S7-300 and ET 200M I/O Systems | Purchases will no longer be available after October 1, 2025. |
| Abb | MS325/MO325 Family | Entered the limited phase in January 2024 and will become obsolete by July 2025. |
| Omron | G8N Series DC Relays | Discontinuation for G8N-1 DC12 and G8N-17LR DC12 by the end of September 2025. |
| Infineon | SGW25N120 IGBT | Scheduled for EOL, with a final delivery date of September 30, 2025. |
| Manufacturer | Part | Info |
| Vishay | Si2315BDS | Last Time Buy (LTB) date of February 28, 2025. |
| Allen-Bradley | RSLogix 5 Software | Final Lifecycle Phase on December 31, 2025. |
| Siemens | S7-300 and ET 200M I/O Systems | Purchases will no longer be available after October 1, 2025. |
| Abb | MS325/MO325 Family | Entered the limited phase in January 2024 and will become obsolete by July 2025. |
| Omron | G8N Series DC Relays | Discontinuation for G8N-1 DC12 and G8N-17LR DC12 by the end of September 2025. |
| Infineon | SGW25N120 IGBT | Scheduled for EOL, with a final delivery date of September 30, 2025. |
TEST & FAILURE RATES
In Q1 2025, 79.3% of tested components met quality standards, while 12.5% required further evaluation, and 8.2% were deemed unacceptable.
While most components passed, nearly 1 in 5 required further inspection or were rejected, highlighting ongoing supply chain risks.
By Device Type
Top 10 Component Types by Failure Rate
| 1. Ethernet Cards 2. Power Driver Modules 3. CPUs 4. Embedded Flash Microcontrollers 5. LEDs |
6. CMOS EEPROMs 7. SRAM 8. Oscillators 9. Digital Signal Processors (DSPs) 10. DRAM |
This ranking is determined by the proportion of failed results compared to the total units tested in each category. While some failures stem from aging or mishandling, others could indicate more serious quality issues or potential counterfeit threats
EARNINGS RECAP
This report summarizes the latest earnings results from the biggest brands in electronic components, highlighting key trends and financial insights.
AUTOMOTIVE
Analog Devices (ADI)
• Revenue: $2.42 billion
• YoY Revenue Growth: -4%
• Adjusted EPS: $1.63
• Q2 Guidance (Revenue): $2.5 billion
• Q2 Guidance (EPS): $1.68
STMicroelectronics
• Estimated Q1 Revenue: $2.51 billion
• YoY Revenue Growth: -28%
• Projected Gross Margin: 33.8%
ON Semiconductor (Onsemi)
• Q4 2024 Revenue: $1.72 billion
• Q4 2024 Adjusted EPS: $0.95
• Q1 2025 Guidance (Revenue): $1.35–$1.45 billion
• Q1 2025 Guidance (EPS): $0.45–$0.55
Growth is driven by EVs, ADAS, and higher semiconductor content. Challenges include inventory digestion, demand softness, and geopolitical tensions. Outlook remains positive with SiC adoption and market recovery expected in H2 2025 as inventory levels normalize and demand strengthens.
Source: https://www.precedenceresearch.com/electric-vehicle-market
PRODUCT UPDATES
Integrated Circuits
Advancements in Process Technology: Intel and TSMC are investing in sub-10nm process nodes to improve performance and energy efficiency for applications in consumer electronics and the automotive sector.
Supply Chain Diversification: Samsung and Texas Instruments are diversifying supply chains and increasing production capacities to address global semiconductor shortages, reduce lead times, and meet rising demand.
FPGA
Embedded FPGA Integration: Xilinx (AMD) and Intel are integrating embedded FPGAs into SoC designs, offering enhanced flexibility for post-production hardware modifications in industries like automotive and telecommunications.
AI and Machine Learning Applications: Embedded FPGAs are increasingly adopted in AI and machine learning for edge tasks, including real-time image/video processing, sensor fusion, and natural language processing, due to their efficiency.
Passives
Miniaturization Efforts: Murata and AVX are developing smaller passive components to support the demand for compact, portable devices, particularly in the consumer electronics and medical sectors.
Enhanced Performance Materials: Vishay and KEMET are using advanced materials to produce capacitors and resistors with higher tolerance and stability, meeting the demands of high-frequency and high-temperature applications.
MANUFACTURER UPDATES
SK Hynix
Customer Order Acceleration Due to Tariffs: In anticipation of new U.S. tariffs on semiconductors, SK Hynix reported that some customers have expedited their orders, leading to favorable market conditions.
Nvidia
Advancements in AI and High-Performance Computing GPUs: NVIDIA is developing GPUs for AI and high-performance computing, integrating HBM3E memory to enhance processing capabilities.
Samsung
Leadership Transition Amidst Strategic Challenges: After co-CEO Han Jong-hee’s passing, Jun Young-hyun becomes Samsung’s sole CEO, managing both divisions amid AI semiconductor challenges.
Intel
Completion of NAND Business Divestiture: Intel finalized the sale of its NAND memory business to SK Hynix for $1.9 billion, allowing it to focus on core processor and data-centric operations.
