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LEAD TIMES
We cover the current lead times and pricing trends for Analog, Power, Passive, Memory, Logic & Digital, and Electromechanical components.
Factory Lines |
Open Market |
|||||
|---|---|---|---|---|---|---|
| Products | Manufacturer | LT | Prognosis | Pricing | Availability | Pricing |
| eMMC | ADATA | 26-52 | ||||
| Alliance Memory | 12-26 | |||||
| IGBT’s | STM | 14-20 | ||||
| Littelfuse | 15-60 | |||||
| Capacitors | EATON | 10-20 | ||||
| Vishay | 12-14 | |||||
| Memory Modules | Kingston | 6-12 | ||||
| ADATA | 26-52 | |||||
| 8 Bit MCU | Renesas | 14-18 | ||||
| NXP | 16-39 | |||||
| Relays | Infineon | 40-52 | ||||
| TE Connectivity | 18-20 | |||||
Factory Lines |
Open Market |
|||||
|---|---|---|---|---|---|---|
| Products | Manufacturer | LT | Prognosis | Pricing | Availability | Pricing |
| eMMC | ADATA | 26-52 | ||||
| Alliance Memory | 12-26 | |||||
| IGBT’s | STM | 14-20 | ||||
| Littelfuse | 15-60 | |||||
| Capacitors | EATON | 10-20 | ||||
| Vishay | 12-14 | |||||
| Memory Modules | Kingston | 6-12 | ||||
| ADATA | 26-52 | |||||
| 8 Bit MCU | Renesas | 14-18 | ||||
| NXP | 16-39 | |||||
| Relays | Infineon | 40-52 | ||||
| TE Connectivity | 18-20 | |||||
END-OF-LIFE REPORTS
We highlight the EOL components from major brands, helping companies manage obsolescence and plan for replacements.
| Manufacturer | Part | EOL | Replacement |
| On Semiconductor | MC34717 | Apr 2026 | MC34933 |
| Infineon | IR2110 | Sep 2026 | Newer TrenchFET or OptiMOS |
| Vishay | VS-1N4148 | Mar 2026 | 1N4148W |
| Diodes Incorporated | APX803L05-1 2C3-7 |
Mar 2026 | Equivalent APX803 series parts |
| NXP | MPC5554 | Sep 2026 | Newer MPC57xx or S32 |
| Renesas | PD78F0730 | Jun 2026 | RL78/G1x or RA series |
| Manufacturer | Part | EOL | Replacement |
| On Semiconductor | MC34717 | Apr 2026 | MC34933 |
| Infineon | IR2110 | Sep 2026 | Newer TrenchFET or OptiMOS |
| Vishay | VS-1N4148 | Mar 2026 | 1N4148W |
| Diodes Incorporated | APX803L05-1 2C3-7 |
Mar 2026 | Equivalent APX803 series parts |
| NXP | MPC5554 | Sep 2026 | Newer MPC57xx or S32 |
| Renesas | PD78F0730 | Jun 2026 | RL78/G1x or RA series |
TEST & FAILURE RATES
In Q4 2025, diodes and transistors showed the highest failure rates, indicating stress in power and signal paths. MOSFETs followed, while FPGAs and logic ICs required ongoing validation. Memory, MCUs, RF, and power management devices recorded lower but persistent test exposure across industrial and communications systems.
By Device Type
Top 10 Component Types by Failure Rate
| 1. Clock 2. Diode 3. Codec 4. Interface 5. Crystal, Oscillators, Resonators |
6. DC DC Converters 7. Ethernet 8. Transceiver 9. Capacitor 10. DC DC Switching Regulators |
This ranking is determined by the proportion of failed results compared to the total units tested in each category. While some failures stem from aging or mishandling, others could indicate more serious quality issues or potential counterfeit threats
EARNINGS RECAP
This report summarizes the latest earnings results from the biggest brands in electronic components, highlighting key trends and financial insights.
AUTOMOTIVE
Toyota Motor Corp.
- Revenue: $84.51 B (+3.5% YoY)
- Net income: $5.80 B
- Net Profit Margin: 6.9%
Volkswagen Group
- Revenue: $82.10 B (-4.7% YoY)
- Net income: $2.31 B
- Net Profit Margin: 2.8%
Tesla, Inc.
- Revenue: $23.15 B (-7.1% YoY)
- Net income: $0.80 B
- Net Profit Margin: 3.4%
PRODUCT UPDATES
Integrated Circuits
IC demand is surging due to escalating AI and data-center workloads, driving logic fabs toward system-level integration and advanced nodes (2 nm+), especially from TSMC and Samsung as compute revenue skews to AI Hardware.
Manufacturers like Intel and Broadcom are prioritizing custom ASICs and AI accelerators, reallocating capacity away from legacy nodes, which tightens supply for general-purpose ICs across consumer markets.
FPGA
The global FPGA market is poised for steady expansion in 2026, with major vendors AMD (Xilinx), Intel (Altera), and Microchip benefitting from rising AI/ML, 5G infrastructure, and edge compute demand.
FPGA adoption accelerates in reconfigurable AI inference and telecom, with medium- and high-density devices capturing share as heterogeneous compute architectures proliferate.
eMMC
eMMC faces tighter NAND allocation as producers like Samsung, SK hynix, and Micron prioritize enterprise SSD and HBM production, pushing eMMC supply and pricing pressure in Q2 2026.
Consumer device manufacturers are increasing eMMC capacities in cost-sensitive segments despite constrained supply, driven by AI feature requirements and automotive/industrial storage demand.
MANUFACTURER UPDATES
SK Hynix
SK Hynix is dominating the HBM3E market and accelerating HBM4 development to meet ramping AI server demand. Supply remains extremely tight through Q2, with double-digit price increases expected for enterprise DRAM.
Samsung
Focusing on high-density DDR5 and liquid-cooled AI storage solutions. Samsung is reportedly weighing a double-digit MLCC price hike this April to offset rising raw material and logistics costs.
NXP
NXP is implementing a broad price adjustment effective April 1, 2026. These hikes reflect significant cost increases in raw materials and energy, specifically impacting automotive and industrial control product portfolios.
Intel
Intel is implementing CPU price hikes up to 30% this quarter due to supply chain tightening. Meanwhile, the $14.2B Fab 34 buyback reinforces their aggressive “IDM 2.0” foundry turnaround strategy.

