MARKET REPORT Q2 2026

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Banner for ASC Global’s Q1 2026 Electronics Market Report highlighting memory and logic supply shifts: SK Hynix prioritizing HBM for AI, Samsung reallocating wafer capacity to premium HBM and DDR5, Micron selling out AI-optimized memory, and Intel advancing Meteor Lake and Nova Lake while managing legacy CPU node constraints.
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LEAD TIMES

We cover the current lead times and pricing trends for Analog, Power, Passive, Memory, Logic & Digital, and Electromechanical components.

Factory Lines

Open Market

Products Manufacturer LT Prognosis Pricing Availability Pricing
eMMC ADATA 26-52 icon arrow up icon arrow up icon arrow down icon arrow up
Alliance Memory 12-26 icon arrow up icon arrow up icon arrow down icon arrow up
IGBT’s STM 14-20 icon arrow up icon arrow double icon arrow double icon arrow double
Littelfuse 15-60 icon arrow double icon arrow up icon arrow double icon arrow double
Capacitors EATON 10-20 icon arrow down icon arrow double icon arrow up icon arrow up
Vishay 12-14 icon arrow double icon arrow double icon arrow down icon arrow up
Memory Modules Kingston 6-12 icon arrow up icon arrow up icon arrow down icon arrow up
ADATA 26-52 icon arrow up icon arrow up icon arrow down icon arrow up
8 Bit MCU Renesas 14-18 icon arrow double icon arrow double icon arrow double icon arrow double
NXP 16-39 icon arrow up icon arrow double icon arrow double icon arrow double
Relays Infineon 40-52 icon arrow double icon arrow up icon arrow double icon arrow up
TE Connectivity 18-20 icon arrow double icon arrow double icon arrow double icon arrow double

Factory Lines

Open Market

Products Manufacturer LT Prognosis Pricing Availability Pricing
eMMC ADATA 26-52 icon arrow up icon arrow up icon arrow down icon arrow up
Alliance Memory 12-26 icon arrow up icon arrow up icon arrow down icon arrow up
IGBT’s STM 14-20 icon arrow up icon arrow double icon arrow double icon arrow double
Littelfuse 15-60 icon arrow double icon arrow up icon arrow double icon arrow double
Capacitors EATON 10-20 icon arrow down icon arrow double icon arrow up icon arrow up
Vishay 12-14 icon arrow double icon arrow double icon arrow down icon arrow up
Memory Modules Kingston 6-12 icon arrow up icon arrow up icon arrow down icon arrow up
ADATA 26-52 icon arrow up icon arrow up icon arrow down icon arrow up
8 Bit MCU Renesas 14-18 icon arrow double icon arrow double icon arrow double icon arrow double
NXP 16-39 icon arrow up icon arrow double icon arrow double icon arrow double
Relays Infineon 40-52 icon arrow double icon arrow up icon arrow double icon arrow up
TE Connectivity 18-20 icon arrow double icon arrow double icon arrow double icon arrow double

END-OF-LIFE REPORTS

We highlight the EOL components from major brands, helping companies manage obsolescence and plan for replacements.

Manufacturer Part EOL Replacement
On Semiconductor MC34717 Apr 2026 MC34933
Infineon IR2110 Sep 2026 Newer TrenchFET or OptiMOS
Vishay VS-1N4148 Mar 2026 1N4148W
Diodes Incorporated APX803L05-1
2C3-7
Mar 2026 Equivalent APX803 series parts
NXP MPC5554 Sep 2026 Newer MPC57xx or S32
Renesas PD78F0730 Jun 2026 RL78/G1x or RA series
Manufacturer Part EOL Replacement
On Semiconductor MC34717 Apr 2026 MC34933
Infineon IR2110 Sep 2026 Newer TrenchFET or OptiMOS
Vishay VS-1N4148 Mar 2026 1N4148W
Diodes Incorporated APX803L05-1
2C3-7
Mar 2026 Equivalent APX803 series parts
NXP MPC5554 Sep 2026 Newer MPC57xx or S32
Renesas PD78F0730 Jun 2026 RL78/G1x or RA series

TEST & FAILURE RATES

In Q4 2025, diodes and transistors showed the highest failure rates, indicating stress in power and signal paths. MOSFETs followed, while FPGAs and logic ICs required ongoing validation. Memory, MCUs, RF, and power management devices recorded lower but persistent test exposure across industrial and communications systems.

By Device Type

Pie chart illustrating Q2 2026 component test exposure and failure rates: diodes and transistors represent the largest share, followed by MOSFETs; FPGAs and logic ICs show moderate exposure, while memory, MCUs, RF, and power management devices account for smaller but ongoing portions across industrial and communications systems.

Top 10 Component Types by Failure Rate

1. Clock
2. Diode
3. Codec
4. Interface
5. Crystal, Oscillators, Resonators
6. DC DC Converters
7. Ethernet
8. Transceiver
9. Capacitor
10. DC DC Switching Regulators

 

This ranking is determined by the proportion of failed results compared to the total units tested in each category. While some failures stem from aging or mishandling, others could indicate more serious quality issues or potential counterfeit threats

EARNINGS RECAP

This report summarizes the latest earnings results from the biggest brands in electronic components, highlighting key trends and financial insights.

AUTOMOTIVE

Toyota Motor Corp.

  • Revenue: $84.51 B (+3.5% YoY)
  • Net income: $5.80 B
  • Net Profit Margin: 6.9%

Volkswagen Group

  • Revenue: $82.10 B (-4.7% YoY)
  • Net income: $2.31 B
  • Net Profit Margin: 2.8%

Tesla, Inc.

  • Revenue: $23.15 B (-7.1% YoY)
  • Net income: $0.80 B
  • Net Profit Margin: 3.4%

PRODUCT UPDATES

Integrated Circuits

IC demand is surging due to escalating AI and data-center workloads, driving logic fabs toward system-level integration and advanced nodes (2 nm+), especially from TSMC and Samsung as compute revenue skews to AI  Hardware.

Manufacturers like Intel and Broadcom are prioritizing custom ASICs and AI accelerators, reallocating capacity away from legacy nodes, which tightens supply for general-purpose ICs across consumer markets.

FPGA

The global FPGA market is poised for steady expansion in 2026, with major vendors AMD (Xilinx), Intel (Altera), and Microchip benefitting from rising AI/ML, 5G infrastructure, and edge compute demand.

FPGA adoption accelerates in reconfigurable AI inference and telecom, with medium- and high-density devices capturing share as heterogeneous compute architectures proliferate.

eMMC

eMMC faces tighter NAND allocation as producers like Samsung, SK hynix, and Micron prioritize enterprise SSD and HBM production, pushing eMMC supply and pricing pressure in Q2 2026.

Consumer device manufacturers are increasing eMMC capacities in cost-sensitive segments despite constrained supply, driven by AI feature requirements and automotive/industrial storage demand.

MANUFACTURER UPDATES

SK Hynix

SK Hynix is dominating the HBM3E market and accelerating HBM4 development to meet ramping AI server demand. Supply remains extremely tight through Q2, with double-digit price increases expected for enterprise DRAM.

Samsung

Focusing on high-density DDR5 and liquid-cooled AI storage solutions. Samsung is reportedly weighing a double-digit MLCC price hike this April to offset rising raw material and logistics costs.

NXP

NXP is implementing a broad price adjustment effective April 1, 2026. These hikes reflect significant cost increases in raw materials and energy, specifically impacting automotive and industrial control product portfolios.

Intel

Intel is implementing CPU price hikes up to 30% this quarter due to supply chain tightening. Meanwhile, the $14.2B Fab 34 buyback reinforces their aggressive “IDM 2.0” foundry turnaround strategy.

Customer Challenges – ASC Solutions
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