MARKET REPORT Q4 2025

ASC Global brings you the latest semiconductor industry findings with our Market Report, helping to provide valuable guidance for maneuvering market intervals. We excel in supply chain strategies that effectively address market volatility.

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LEAD TIMES

We cover the current lead times and pricing trends for Analog, Power, Passive, Memory, Logic & Digital, and Electromechanical components.

Factory Lines

Open Market

Products Manufacturer LT Prognosis Pricing Availability Pricing
Sensors Melexis 12-60 icon arrow double icon arrow double icon arrow double icon arrow double
TE Connectivity 16-52 icon arrow double icon arrow double icon arrow double icon arrow double
IGBT’s Infineon 10-42 icon arrow double icon arrow double icon arrow double icon arrow double
Vishay 14-20 icon arrow up icon arrow double icon arrow double icon arrow double
Capacitors EATON 20-30 icon arrow down icon arrow double icon arrow double icon arrow double
Vishay 12-14 icon arrow double icon arrow double icon arrow double icon arrow double
Memory Modules Kingston 6-12 icon arrow up icon arrow up icon arrow up icon arrow up
ADATA 6-8 icon arrow up icon arrow up icon arrow up icon arrow up
8 Bit MCU Renesas 14-18 icon arrow double icon arrow double icon arrow double icon arrow up
NXP 13-39 icon arrow double icon arrow double icon arrow double icon arrow double
Relays American Zettler 16-30 icon arrow double icon arrow double icon arrow double icon arrow up
TE Connectivity 12-14 icon arrow double icon arrow up icon arrow double icon arrow double

Factory Lines

Open Market

Products Manufacturer LT Prognosis Pricing Availability Pricing
Sensors Melexis 12-60 icon arrow double icon arrow double icon arrow double icon arrow double
TE Connectivity 16-52 icon arrow double icon arrow double icon arrow double icon arrow double
IGBT’s Infineon 10-42 icon arrow double icon arrow double icon arrow double icon arrow double
Vishay 14-20 icon arrow up icon arrow double icon arrow double icon arrow double
Capacitors EATON 20-30 icon arrow down icon arrow double icon arrow double icon arrow double
Vishay 12-14 icon arrow double icon arrow double icon arrow double icon arrow double
Memory Modules Kingston 6-12 icon arrow up icon arrow up icon arrow up icon arrow up
ADATA 6-8 icon arrow up icon arrow up icon arrow up icon arrow up
8 Bit MCU Renesas 14-18 icon arrow double icon arrow double icon arrow double icon arrow up
NXP 13-39 icon arrow double icon arrow double icon arrow double icon arrow double
Relays American Zettler 16-30 icon arrow double icon arrow double icon arrow double icon arrow up
TE Connectivity 12-14 icon arrow double icon arrow up icon arrow double icon arrow double

END-OF-LIFE REPORTS

We highlight the EOL components from major brands, helping companies manage obsolescence and plan for replacements.

Manufacturer Part EOL Replacement
Analog Devices ADP2443 Feb 2026 ADI alternative FETs as suggested in PDN
Infineon SGW25N120 Sep 2025 IGW25N120H3
Siemens S7-300 System Oct 2025 SIMATIC S7-1500
Allen-Bradley RSLogix 5 Dec 2025 Studio 5000
Omron G8N-1 DC12 Relay Sep 2025 G8NB family replacements
Renesas ISL95837HRZ Jul 2025 Renesas VR family
Manufacturer Part EOL Replacement
Analog Devices ADP2443 Feb 2026 ADI alternative FETs as suggested in PDN
Infineon SGW25N120 Sep 2025 IGW25N120H3
Siemens S7-300 System Oct 2025 SIMATIC S7-1500
Allen-Bradley RSLogix 5 Dec 2025 Studio 5000
Omron G8N-1 DC12 Relay Sep 2025 G8NB family replacements
Renesas ISL95837HRZ Jul 2025 Renesas VR family

TEST & FAILURE RATES

In Q1 2025, 79.3% of tested components met quality standards, while 12.5% required further evaluation, and 8.2% were deemed unacceptable.
While most components passed, nearly 1 in 5 required further inspection or were rejected, highlighting ongoing supply chain risks.

By Device Type

A graph displaying the most tested components by device, offering a comprehensive overview of semiconductor devices and integrated circuits. The graph highlights key manufacturers, showing trends and demand shifts in the electronic components landscape. It includes analysis of leading brands, their market share, and how their strategies shape the current and future state of the industry.

Top 10 Component Types by Failure Rate

1. Rectifiers
2. Discrete Semiconductor Products
3. Passive-Resistor
4. Digital Signal Processing (DSP)
5. Converter
6. Inductor
7. DC Converters
8. Processor
9. FPGA
10. CPLD

 

This ranking is determined by the proportion of failed results compared to the total units tested in each category. While some failures stem from aging or mishandling, others could indicate more serious quality issues or potential counterfeit threats

EARNINGS RECAP

This report summarizes the latest earnings results from the biggest brands in electronic components, highlighting key trends and financial insights.

AUTOMOTIVE

Magna International

  • Revenue: $10.06 billion (–8.2% YoY)
  • Net income: $146 million
  • Adjusted EPS: $0.78 (–28% YoY)
Bosch Group

  • Revenue: $535.9 million (+6.2% YoY)
  • Net profit: $79.8 million (+8.6% YoY)
  • Net profit margin: $54.9 million (–11.6% YoY)
TE Connectivity

  • Revenue: $4.53 billion (+14% YoY)
  • Adjusted EPS: $2.27
  • Adjusted EBIT margin: ~25%

PRODUCT UPDATES

Integrated Circuits

Texas Instruments, ADI, and NXP prioritize analog/power ICs and fab upgrades, securing automotive windows; lead-time pressure persists, with logic/programmable ICs easier to source than memory and passive lines.

Maxim Integrated launches extended automotive-qualified ICs, TI extends industrial portfolios, and ADI offers long-term allocation agreements for OEMs to secure critical IC supply.

FPGA

AMD/Xilinx and Intel segment supply: commodity families stable, but UltraScale+ and automotive-grade face long allocations; OEMs encouraged toward early commitments and partner boards to secure FPGA capacity.

Lattice Semiconductor provides low-power automotive FPGAs, AMD and Xilinx prioritize hyperscaler/telecom allocations, creating a two-tier supply between commodity and high-end SKUs.

Passives

Murata, TDK, and Yageo expand high-value dielectric and MLCC production, prioritizing automotive/industrial allocations; Murata begins new 0402 47µF MLCC runs, reinforcing constrained specialty product availability.

KEMET adds automotive capacitor production, Murata and TDK reinforce wafer capacity, while OEMs adopt multi-vendor sourcing and blanket purchase strategies to manage lead-time risks.

MANUFACTURER UPDATES

SK Hynix

SK hynix has completed development of HBM4 preparing for mass production of this next-generation memory product aimed at ultra-high-performance AI applications.

Samsung

Samsung has reduced the price of its 2nm wafers to $20,000, undercutting TSMC’s $30,000 price by 33%, to ensure utilization of its 2nm production capacity amid heightened.

Micron

Micron has projected higher-than-expected revenue for Q1 2026, driven by growing demand for its high-bandwidth memory (HBM) products amid the global AI boom.

Intel

Intel has approached TSMC to explore potential investments or partnerships, aiming to secure external investments amid ongoing challenges in the competitive chip industry.

Customer Challenges – ASC Solutions
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For more news and industry insights dive into our Component Compass