INDUSTRY UPDATES

ASC Global brings you with our Component Compass report the latest semiconductor industry findings to provide valuable guidance for maneuvering market intervals. We excel in supply chain strategies that effectively address market volatility.

If any questions or concerns arise, kindly reach out to your Account Manager or our support team at info@ascglobal.com | +1 954 718 2950.

ASC Global's biweekly Component Compass to Navigate the Marketplace

Get biweekly updates to your inbox

First Name(Required)
Banner for ASC Global’s Component Compass report featuring semiconductor and electronics industry news, including TI’s $60B U.S. chip expansion, Japan’s push for rare earth alternatives, TSMC’s waiver risks, Renesas losses tied to Wolfspeed, SK hynix’s HBM leadership, and a 67% spike in DDR4 prices surpassing DDR5.

Last Updated: 6/27/25

TI Launches Historic $60B U.S. Chip Expansion Initiative

Texas Instruments will invest over $60 billion to build seven new semiconductor fabs across Texas and Utah, marking the largest U.S. chip manufacturing investment ever. Backed by Apple, Ford, NVIDIA, and others, the initiative will support 60,000 jobs and strengthen domestic production of critical semiconductors for AI, automotive, and electronics.

Japan Advances Rare Earth Alternatives to Curb China Dependence

Japan is accelerating efforts to reduce its reliance on Chinese rare earths, despite imports rising to 63% in 2024. Key firms like Daido Steel and Proterial are innovating low-rare-earth magnets, while recycling and overseas investments grow. Still, Japan depends entirely on China for heavy rare earths, highlighting ongoing challenges.

TSMC Faces U.S. Waiver Risk, FX Pressure on Margins

TSMC confronts two major Q2 challenges: the U.S. may revoke its China tech waivers, forcing license applications, and the New Taiwan dollar has surged 12%, threatening margins. Each 1% appreciation reduces gross margin by 0.4 points. Despite strong revenue projections, profitability may hit lower-end targets due to currency impacts.

Renesas Faces ¥250B Loss as Wolfspeed Preps Bankruptcy

Renesas expects a ¥250B loss after Wolfspeed, its SiC wafer supplier, announces a prepackaged bankruptcy plan. Renesas will convert its $2.06B deposit into Wolfspeed equity and debt. Slowing EV demand and Chinese oversupply led Renesas to exit SiC production. Rivals like STMicro and Infineon are poised to gain market share.

SK hynix Leads in Custom HBM; Rivals Trail in HBM4 Race

SK hynix is set to launch its first custom HBM—likely HBM4E—in late 2026, with major clients like NVIDIA, Microsoft, and Broadcom. While Samsung and Micron trail with HBM4 development, SK hynix’s lead in tailored solutions and logic-based base die design positions it at the forefront of AI memory innovation.

Legacy DDR4 Prices Surge 67%, Surpass DDR5 Rates

DDR4 chip prices soared 67% in June, surpassing DDR5 for the first time, with 16-Gb DDR4 chips now 44% costlier. Reduced production by major suppliers and sustained demand from legacy systems are driving the spike. OEMs face higher costs, while attention shifts to Taiwanese firms for DDR4 supply stability.

More Component Compass news

Intel to Cut 20% of Fab Staff in Strategic Shift

Intel plans to lay off up to 20% of its manufacturing workforce starting in July, impacting over 10,000 jobs. The move reflects financial strain and strategic realignment amid weak chip sales and rising competition. Analysts say the cuts underscore Intel’s struggle to streamline operations and revive its foundry business.

UK Invests £35M to Grow Semiconductor Talent Pipeline

The UK government will allocate £35 million to expand its Semiconductor Talent Expansion Programme, funding chip design courses, bursaries, and career conversion programs through 2029. Alongside £19 million for a new Semiconductor Centre, the initiative aims to strengthen the UK’s role in global chip supply chains and foster a skilled workforce.

Infineon Expands Memory Solutions for New Space Market

Infineon has launched radiation-tolerant FRAM, NOR Flash, and pSRAM memory families tailored for NewSpace LEO satellite constellations. These compact, cost-effective components suit short missions and support -55°C to +125°C operation. Combined with radiation-tolerant power MOSFETs, Infineon targets high-redundancy, high-throughput applications in emerging commercial satellite deployments.

ST Unveils LEOPOL1 Converter for LEO Satellite Systems

STMicroelectronics launched the LEOPOL1, a radiation-hardened point-of-load converter for Low Earth Orbit satellites. Built on BCD6-SOI tech, it withstands TID of 50 krad and supports 7A output. Ideal for New Space missions, LEOPOL1 enhances power system flexibility, reliability, and efficiency for cost-effective satellite deployment and multi-voltage platform designs.

Micron’s $200B U.S. Chip Investment Faces Key Hurdles

Micron plans to invest $200 billion to reshore memory chip production, including DRAM and HBM, across sites in Idaho, New York, and Virginia. Analysts warn of cost and talent challenges, especially in New York. While CHIPS Act funding aids efforts, geopolitical risks and profitability remain core concerns for the ambitious initiative.

Infineon Unveils First GaN FET with Integrated Schottky Diode

Infineon has introduced the first GaN power FET with an integrated Schottky diode, part of its CoolGaN G5 series. Optimized for hard-switching applications, the device enhances energy efficiency, reduces BOM costs, and supports compact, high-frequency designs for data centers, EV chargers, and industrial converters operating above 1 MHz.

Market Report

Mini banner promoting our Market Report Q2 2025

For more news and industry insights dive into our Market Report