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Last Updated: 4/25/25
Samsung Risks Tariffs Delaying Chip Tool Imports to Texas
Samsung denies delaying its Texas fab to 2027, but hesitates to import costly EUV tools, raising tariff concerns. Despite near-complete construction, equipment delays, and staffing challenges persist. The foundry division faces losses, while rivals like TSMC also struggle with overseas fabs, facing rising costs and shrinking margins in early operations.
Neuralink Potential Valuation of $8.5 billion.
Neuralink, Elon Musk’s brain implant company, is reportedly seeking to raise $500 million at an $8.5 billion valuation. The funding talks are in early stages and follow its 2023 $5 billion valuation. Neuralink’s device, aimed at helping spinal injury patients, has enabled patients to control digital interfaces using brain signals.
GE Aerospace Q1 2025 – Strong Earnings
GE Aerospace reported strong first-quarter results, with shares rising 2.95% in pre-market trading. UBS raised its price target to $216, citing robust margins and effective tariff mitigation strategies. CEO Larry Culp met with former President Trump to discuss aviation tariffs, advocating for a tariff-free regime to support the industry.
Lenovo, HP, Dell eye Saudi production amid tariff concerns.
Amid Trump-era tariff fears, Lenovo, HP, and Dell eye Saudi Arabia for PC production. Lenovo plans a $2B Riyadh plant by 2026. HP and Dell explore local sites, while ODMs remain cautious. Saudi Arabia offers incentives, low U.S. tariffs, and PIF backing to grow its tech manufacturing sector.
IBM Flags Chip Risks, Backs Japan’s Rapidus as Alternative
IBM CEO Arvind Krishna warns of chip supply chain risks due to overreliance on major players. He backs Japan’s Rapidus as a strategic alternative, citing IBM’s 2nm partnership. With $5.71B in new subsidies, Rapidus aims for 2027 mass production. IBM stresses diversification, skilled talent, and technology transfer for resilience.
EU Fines Apple, Meta Under New Digital Markets Act
The EU has fined Apple €500M and Meta €200M under the new Digital Markets Act, targeting anti-competitive practices. The landmark move signals a tougher stance on U.S. tech giants and digital market fairness. Both companies pushed back, raising concerns over regulatory bias and escalating U.S.-EU trade tensions.
Musk Focusing on Tesla
Elon Musk announced he would step back from his role at DOGE to refocus on Tesla, following a 44% decline in Tesla’s stock earlier in the year. Despite reporting its worst earnings in years, Tesla’s stock surged by up to 8%, driven by investor optimism about Musk’s renewed focus on the company.
TSMC to begin advanced A14 chip production in 2028.
TSMC plans to launch its A14 chip process in 2028, advancing beyond its 3nm and upcoming 2nm technologies. An intermediary A16 process is set for 2026. The company remains bullish on AI-driven demand and forecasts the chip industry will surpass $1 trillion in revenue by 2030.
Boeing Q1 Report and Seeking Buyers for Returned Aircrafts
Boeing reported first-quarter revenues of $19.5 billion, surpassing expectations, with a reduced net loss of $31 million. The company plans to increase 737 Max production to 38 units per month. Boeing is also seeking new buyers for up to 50 aircraft returned by Chinese airlines due to retaliatory tariffs. The company remains optimistic about redirecting these planes to other global customers.
Lockheed Martin Acquisition Plans and F-35 Upgrade
Lockheed Martin announced plans to acquire Amentum’s Rapid Solutions business, aiming to enhance its capabilities in advanced defense technologies. F-35 Upgrade: Following the loss of the Next-Generation Air Dominance (NGAD) contract to Boeing, Lockheed is considering a “fifth generation-plus” variant of its F-35 fighter jet, offering advanced capabilities at a more accessible price point.
NextEra Energy Renewable Energy Expansion
NextEra Energy exceeded Wall Street expectations with an adjusted profit of 99 cents per share, driven by strong electricity demand and growth in its renewable energy segment. The company added 3.2 GW of new renewable energy and storage to its backlog, now totaling 28 GW, reflecting its commitment to clean energy initiatives.
Samsung Ends DDR4, Shifts Focus to DDR5, HBM
Samsung will end production of its 8Gb LPDDR4 1z-node memory by October 2025, shifting focus to higher-margin DDR5 and HBM products. The move reflects weak demand, intense price pressure, and rising Chinese competition in the DDR4 market. Analysts expect reduced global DRAM bit growth in 2025 amid a tough memory landscape.
More Component Compass news
SK Hynix profit jumps; HBM3E rises, tariff risks loom.
SK Hynix’s Q1 profit soared 158% YoY, driven by booming AI chip sales and pre-tariff stockpiling. Revenue hit 17.6 trillion won, up 42%. Despite macro uncertainty, demand for 12-layer HBM3E and DDR5 remains strong. The company eyes growth from AI-focused modules like LPCAMM2 and SOCAMM2 amid resilient tech spending.
Littelfuse launches IXD2012NTR gate driver for high-speed power
Littelfuse launched the IXD2012NTR, a high-speed gate driver for N-channel MOSFETs/IGBTs in half-bridge setups, ideal for DC-DC converters, inverters, and motor controllers. It features a 10–20V range, 200V high-side switching, TTL/CMOS compatibility, and cross-conduction protection. Its robust output currents and compact design ensure reliable, high-frequency performance in harsh conditions.
TSMC plans an independent Arizona GigaFab
TSMC’s Fab 21 in Arizona is progressing, with 3nm equipment installation underway and 2nm and 1.6nm modules set to begin construction this year for 2029 production. CEO CC Wei says 30% of TSMC’s advanced capacity will be U.S.-based, forming a GigaFab cluster to bolster America’s chip ecosystem and supply chain.
Arm sells Artisan IP portfolio to Cadence for expansion
Arm sold its Artisan IP portfolio to Cadence, retaining some rights. This move is part of Arm’s shift toward proprietary IC development, reducing maintenance costs for Artisan. Cadence aims to expand its design IP offerings, enhancing its position in the foundation IP market and improving its chiplet and design services.
Hanmi Semiconductor is experiencing strong demand for TC bonders, particularly from Micron and Chinese clients.
Hanmi Semiconductor is reportedly experiencing strong demand for its TC bonder equipment, primarily from Micron and Chinese clients. The company’s TC bonders, used for advanced packaging in semiconductor manufacturing, are in high demand as chipmakers ramp up production, especially in memory and AI-related technologies.
Vishay unveils 600 V standard
Vishay Intertechnology introduced 27 new surface-mount rectifiers in the DFN33A package, offering high efficiency for commercial, industrial, telecom, and automotive applications. These rectifiers provide up to 9 A current ratings, with voltage options from 60 V to 600 V. They feature low profile, superior thermal performance, and automated placement suitability. The devices also offer AEC-Q101 qualification and high temperature operation up to +175 °C.
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