Market Report Q3 2025
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LEAD TIMES
We cover the current lead times and pricing trends for Analog, Power, Passive, Memory, Logic & Digital, and Electromechanical components.
Factory Lines | Open Market | |||||
---|---|---|---|---|---|---|
Products | Manufacturer | LT | Prognosis | Pricing | Availability | Pricing |
Sensors | onsemi | 18-52 | ||||
Vishay | 24-52 | |||||
IGBT’s | Microchip | 14-26 | ||||
Infineon | 10-42 | |||||
Capacitors | Kyocera | 14-16 | ||||
ELNA | 25-30 | |||||
Memory Modules | Centon | 6-8 | ||||
SMART Modular | 12-18 | |||||
8 Bit MCU | Infineon | 10-26 | ||||
NXP | 13-39 | |||||
Relays | American Zettler | 16-30 | ||||
Infineon | 40-52 |
Factory Lines | Open Market | |||||
---|---|---|---|---|---|---|
Products | Manufacturer | LT | Prognosis | Pricing | Availability | Pricing |
Sensors | onsemi | 18-52 | ||||
Vishay | 24-52 | |||||
IGBT’s | Microchip | 14-26 | ||||
Infineon | 10-42 | |||||
Capacitors | Kyocera | 14-16 | ||||
ELNA | 25-30 | |||||
Memory Modules | Centon | 6-8 | ||||
SMART Modular | 12-18 | |||||
8 Bit MCU | Infineon | 10-26 | ||||
NXP | 13-39 | |||||
Relays | American Zettler | 16-30 | ||||
Infineon | 40-52 |
END-OF-LIFE REPORTS
We highlight the EOL components from major brands, helping companies manage obsolescence and plan for replacements.
Manufacturer | Part | Info |
Texas Instruments | SN74HC4040 | (14-stage binary counter) – EOL June 2025 |
Analog Devices | ADXL335 | (3-axis accelerometer) – EOL July 2025 |
Microchip | PIC16F676-I/P | (8-bit MCU) – EOL June 2025 |
NXP | 74HC157N | (quad multiplexer) – EOL June 2025 |
Infineon | TLE4935L | (Hall-effect sensor) – EOL July 2025 |
STMicroelectronics | STM32F030F4P6 | (ARM Cortex-M0 MCU) – EOL June 2025 |
Manufacturer | Part | Info |
Texas Instruments | SN74HC4040 | (14-stage binary counter) – EOL June 2025 |
Analog Devices | ADXL335 | (3-axis accelerometer) – EOL July 2025 |
Microchip | PIC16F676-I/P | (8-bit MCU) – EOL June 2025 |
NXP | 74HC157N | (quad multiplexer) – EOL June 2025 |
Infineon | TLE4935L | (Hall-effect sensor) – EOL July 2025 |
STMicroelectronics | STM32F030F4P6 | (ARM Cortex-M0 MCU) – EOL June 2025 |
TEST & FAILURE RATES
In Q1 2025, 79.3% of tested components met quality standards, while 12.5% required further evaluation, and 8.2% were deemed unacceptable.
While most components passed, nearly 1 in 5 required further inspection or were rejected, highlighting ongoing supply chain risks.
By Device Type
Top 10 Component Types by Failure Rate
1. Buffer / Memory Socket 2. DC DC Converter 3. Clock 4. Alluminium Capacitor 5. Oscillator | 6. Controller / SRAM 7. Inverter / LED / Memory Module 8. MCU 9. Active-Diode 10. DRAM / Regulators |
This ranking is determined by the proportion of failed results compared to the total units tested in each category. While some failures stem from aging or mishandling, others could indicate more serious quality issues or potential counterfeit threats
EARNINGS RECAP
This report summarizes the latest earnings results from the biggest brands in electronic components, highlighting key trends and financial insights.
AUTOMOTIVE
• Revenue (midpoint): $2.71 billion (–16% YoY; +7.7% QoQ)
• Gross margin (guided): 33.4%
Bosch Group
• Revenue: €4.394 billion (Q2 2025)
• Operating Income: €519 million
(+19.6% QoQ)
• Net Income: €536.7 million
(+15.1% QoQ)
ON Semiconductor (Onsemi)
• Revenue range: $1.40–1.50 billion
(midpoint $1.45 billion) $0.45–$0.55
• GAAP EPS range: $0.45–0.55
• Non-GAAP EPS range: $0.48–0.58
The EV market is valued at $988.7B in 2025 and
projected to reach $2.53T by 2034, growing at an
11% CAGR. Asia Pacific leads, with BEVs,
passenger cars, and personal use dominating.
Notable future growth is expected in North
America, FCEVs, trucks, AWD systems, 100MPH
vehicles, commercial use, and mid-priced EVs.
Source: https://www.precedenceresearch.com/electric-vehicle-market
PRODUCT UPDATES
Integrated Circuits
Manufacturers like Intel, Samsung, and TSMC: are prioritizing advanced logic IC capacity expansions (28nm and below), driven by AI/data‑center demand; IC lead times have largely stabilized, though specialized ASICs and AI-targeted chips remain tighter.
Supply chain resilience efforts: including fab build-outs in the U.S. (boosted by CHIPS Act) are leading to logic IC lead times decreasing e.g., DDR3/DDR4 and NAND flash parts dropping from 26 weeks to around 10–15 weeks
FPGA
AMD (via Xilinx), Intel (Altera), NVIDIA: continue investing in embedded and adaptive SoCs; Xilinx’ high-end Versal and Intel’s Agilex families are seeing increased traction across 5G, automotive, and data-center applications.
Lead times & capacity focus: while general stabilization occurs, medium-density FPGAs face tighter supply for AI/edge use-cases; development cycles for mid-range parts are lengthening due to higher tooling complexity.
Passives
Manufacturers such as Murata, TDK, Yageo: continue shifting toward just-in-time production following 2023–24 corrections; general-purpose resistors, capacitors, and inductors see stable lead times around 8–12 weeks.
Selective tightness: high-voltage and IGBT capacitors from Infineon and similar vendors are experiencing extended lead times moving into Q3 2025 due to robust demand in automotive and industrial power-electronics..
MANUFACTURER UPDATES
SK Hynix
HBM Leadership and Tech Showcase: SK Hynix holds 70% of the HBM market and revealed its 12-layer HBM3E and HBM4 technologies at Computex and DTW 2025, targeting AI and mobile systems.
Nvidia
AI Valuation Milestone Achieved: Nvidia’s market cap rose to $3.76 trillion, surpassing Microsoft, reflecting dominance in AI GPU segments and strong investor confidence.
Samsung
HBM3E Qualification and Foundry Expansion: Samsung is preparing HBM4 and qualifying HBM3E with Nvidia, while accelerating 2nm foundry development to meet next-gen AI and computing performance needs.
Intel
Efficiency Strategy Post-CHIPS Act: Intel reduced CAPEX by 10% and announced workforce and leadership cuts after receiving $7.9B in CHIPS Act grants to streamline operations.