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LEAD TIMES
We cover the current lead times and pricing trends for Analog, Power, Passive, Memory, Logic & Digital, and Electromechanical components.
Factory Lines | Open Market | |||||
|---|---|---|---|---|---|---|
| Products | Manufacturer | LT | Prognosis | Pricing | Availability | Pricing |
| HBM | SK Hynix | 52+ | ||||
| Samsung | 52+ | |||||
| IGBT’s | STM | 14-20 | ||||
| Littelfuse | 15-60 | |||||
| Capacitors | EATON | 10-20 | ||||
| Vishay | 12-14 | |||||
| Memory Modules | Kingston | 6-12 | ||||
| ADATA | 26-52 | |||||
| 8 Bit MCU | Renesas | 14-18 | ||||
| NXP | 16-39 | |||||
| Relays | Infineon | 40-52 | ||||
| TE Connectivity | 12-14 | |||||
Factory Lines | Open Market | |||||
|---|---|---|---|---|---|---|
| Products | Manufacturer | LT | Prognosis | Pricing | Availability | Pricing |
| HBM | SK Hynix | 52+ | ||||
| Samsung | 52+ | |||||
| IGBT’s | STM | 14-20 | ||||
| Littelfuse | 15-60 | |||||
| Capacitors | EATON | 10-20 | ||||
| Vishay | 12-14 | |||||
| Memory Modules | Kingston | 6-12 | ||||
| ADATA | 26-52 | |||||
| 8 Bit MCU | Renesas | 14-18 | ||||
| NXP | 16-39 | |||||
| Relays | Infineon | 40-52 | ||||
| TE Connectivity | 12-14 | |||||
END-OF-LIFE REPORTS
We highlight the EOL components from major brands, helping companies manage obsolescence and plan for replacements.
| Manufacturer | Part | EOL | Replacement |
| Analog Devices | ADP2443 | Jul 2026 | ADI-recommended buck regulator alternatives |
| Infineon | IR2110 | Feb 2026 | IRS2110S / newer gate drivers |
| Vishay | BC327 | Jan 2026 | BC807 / newer small-signal BJTs |
| Texas Instruments | TPS54560 | Jan 2026 | TPS54561 / newer TI buck regulators |
| NXP | PCA9555 | Jan 2026 | PCA9535 / newer GPIO expanders |
| Renesas | R5F100LGAFB | Feb 2026 | RL78/G23 MCU family |
| Manufacturer | Part | EOL | Replacement |
| Analog Devices | ADP2443 | Jul 2026 | ADI-recommended buck regulator alternatives |
| Infineon | IR2110 | Feb 2026 | IRS2110S / newer gate drivers |
| Vishay | BC327 | Jan 2026 | BC807 / newer small-signal BJTs |
| Texas Instruments | TPS54560 | Jan 2026 | TPS54561 / newer TI buck regulators |
| NXP | PCA9555 | Jan 2026 | PCA9535 / newer GPIO expanders |
| Renesas | R5F100LGAFB | Feb 2026 | RL78/G23 MCU family |
TEST & FAILURE RATES
In Q4 2025, diodes and transistors showed the highest failure rates, indicating stress in power and signal paths. MOSFETs followed, while FPGAs and logic ICs required ongoing validation. Memory, MCUs, RF, and power management devices recorded lower but persistent test exposure across industrial and communications systems.
By Device Type
Top 10 Component Types by Failure Rate
| 1. System on a Chip (SoC) 2. CPU 3. Module 4. Regulator 5. Synthesizer | 6. Inductor 7. Relay 8. Converter 9. Bus 10. Clock Generator |
This ranking is determined by the proportion of failed results compared to the total units tested in each category. While some failures stem from aging or mishandling, others could indicate more serious quality issues or potential counterfeit threats
EARNINGS RECAP
This report summarizes the latest earnings results from the biggest brands in electronic components, highlighting key trends and financial insights.
AUTOMOTIVE
General Motors
- Revenue: $48.59 B (0.3% YoY)
- Net income: $1.33 B
- Net Profit Margin: 2.7%
Ford Motor Company
- Revenue: $50.5 B (+9% YoY)
- Net income: $2.4 B
- Net Profit Margin: 4.8%
Toyota
- Revenue: $93.1 B (+2.9% YoY)
- Net income: $16.5 B
- Net Profit Margin: 17.7%
PRODUCT UPDATES
Integrated Circuits
ICs from STMicroelectronics, Infineon, and TI face extended lead-times as production prioritizes AI and automotive segments; manufacturers are investing in capacity and advanced packaging to manage allocation and logistical pressures.
Legacy logic and MCU devices from NXP and Microchip are being reallocated to strategic customers, forcing distributors to secure longer delivery windows and prioritize forecasted orders.
FPGA
AMD/Xilinx FPGAs, especially automotive-grade and high-end devices, show severe allocation constraints with lead times of 40–52+ weeks; OEMs urged to secure inventory or design alternatives due to slow supply normalization.
Intel (Altera) FPGA availability remains constrained as foundry backlogs persist; sourcing strategies emphasize diversified channels and early forecasts for delivery commitments through mid-2026.
Passives
MLCC and tantalum capacitors from Panasonic, Murata, and Kemet are under allocation pressure with lead-times stretching over 20+ weeks in key profiles, leading OEMs to pre-order and secure slots.
Panasonic tantalum and specialty capacitors see 16–18 week waits, with upstream shortages of HVLP copper foil and fiberglass impacting broader PCB assembly timelines.
MANUFACTURER UPDATES
SK Hynix
SK Hynix is heavily prioritizing high-bandwidth memory production, allocating most advanced capacity to AI applications, effectively limiting availability for consumer memory and reinforcing supply tightness across PCs, smartphones, and storage devices.
Samsung
Samsung is redirecting wafer capacity toward premium HBM and enterprise DDR5, emphasizing profitability over volume, which constrains consumer memory supply and contributes to higher pricing pressure across global electronics markets.
Micron
Micron is focusing production on AI-optimized memory, selling out HBM capacity and leveraging strong margins, while reduced output of mainstream DRAM and NAND intensifies shortages for consumer and enterprise hardware manufacturers.
Intel
Intel is deploying advanced logic (Meteor Lake/Nova Lake) and expanding foundry services, with reported constraints in some legacy CPU nodes while responding to data-center logic demand.