Market Report Q3 2025

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LEAD TIMES

We cover the current lead times and pricing trends for Analog, Power, Passive, Memory, Logic & Digital, and Electromechanical components.

Factory Lines

Open Market

Products Manufacturer LT Prognosis Pricing Availability Pricing
Sensors onsemi 18-52 icon arrow double icon arrow double icon arrow double icon arrow double
Vishay 24-52 icon arrow double icon arrow double icon arrow up icon arrow double
IGBT’s Microchip 14-26 icon arrow double icon arrow double icon arrow double icon arrow double
Infineon 10-42 icon arrow up icon arrow double icon arrow double icon arrow double
Capacitors Kyocera 14-16 icon arrow double icon arrow double icon arrow double icon arrow double
ELNA 25-30 icon arrow down icon arrow double icon arrow double icon arrow double
Memory Modules Centon 6-8 icon arrow double icon arrow up icon arrow down icon arrow up
SMART Modular 12-18 icon arrow double icon arrow up icon arrow down icon arrow up
8 Bit MCU Infineon 10-26 icon arrow double icon arrow double icon arrow double icon arrow up
NXP 13-39 icon arrow double icon arrow double icon arrow double icon arrow double
Relays American Zettler 16-30 icon arrow double icon arrow double icon arrow double icon arrow up
Infineon 40-52 icon arrow double icon arrow up icon arrow double icon arrow up

Factory Lines

Open Market

Products Manufacturer LT Prognosis Pricing Availability Pricing
Sensors onsemi 18-52 icon arrow double icon arrow double icon arrow double icon arrow double
Vishay 24-52 icon arrow double icon arrow double icon arrow up icon arrow double
IGBT’s Microchip 14-26 icon arrow double icon arrow double icon arrow double icon arrow double
Infineon 10-42 icon arrow up icon arrow double icon arrow double icon arrow double
Capacitors Kyocera 14-16 icon arrow double icon arrow double icon arrow double icon arrow double
ELNA 25-30 icon arrow down icon arrow double icon arrow double icon arrow double
Memory Modules Centon 6-8 icon arrow double icon arrow up icon arrow down icon arrow up
SMART Modular 12-18 icon arrow double icon arrow up icon arrow down icon arrow up
8 Bit MCU Infineon 10-26 icon arrow double icon arrow double icon arrow double icon arrow up
NXP 13-39 icon arrow double icon arrow double icon arrow double icon arrow double
Relays American Zettler 16-30 icon arrow double icon arrow double icon arrow double icon arrow up
Infineon 40-52 icon arrow double icon arrow up icon arrow double icon arrow up

END-OF-LIFE REPORTS

We highlight the EOL components from major brands, helping companies manage obsolescence and plan for replacements.

Manufacturer Part Info
Texas Instruments SN74HC4040 (14-stage binary counter) – EOL June 2025
Analog Devices ADXL335 (3-axis accelerometer) – EOL July 2025
Microchip PIC16F676-I/P (8-bit MCU) – EOL June 2025
NXP 74HC157N (quad multiplexer) – EOL June 2025
Infineon TLE4935L (Hall-effect sensor) – EOL July 2025
STMicroelectronics STM32F030F4P6 (ARM Cortex-M0 MCU) – EOL June 2025
Manufacturer Part Info
Texas Instruments SN74HC4040 (14-stage binary counter) – EOL June 2025
Analog Devices ADXL335 (3-axis accelerometer) – EOL July 2025
Microchip PIC16F676-I/P (8-bit MCU) – EOL June 2025
NXP 74HC157N (quad multiplexer) – EOL June 2025
Infineon TLE4935L (Hall-effect sensor) – EOL July 2025
STMicroelectronics STM32F030F4P6 (ARM Cortex-M0 MCU) – EOL June 2025

TEST & FAILURE RATES

In Q1 2025, 79.3% of tested components met quality standards, while 12.5% required further evaluation, and 8.2% were deemed unacceptable.
While most components passed, nearly 1 in 5 required further inspection or were rejected, highlighting ongoing supply chain risks.

By Device Type

A graph displaying the most tested components by device, offering a comprehensive overview of semiconductor devices and integrated circuits. The graph highlights key manufacturers, showing trends and demand shifts in the electronic components landscape. It includes analysis of leading brands, their market share, and how their strategies shape the current and future state of the industry.

Top 10 Component Types by Failure Rate

1. Buffer / Memory Socket
2. DC DC Converter
3. Clock
4. Alluminium Capacitor
5. Oscillator
6. Controller / SRAM
7. Inverter / LED / Memory Module
8. MCU
9. Active-Diode
10. DRAM / Regulators

 

This ranking is determined by the proportion of failed results compared to the total units tested in each category. While some failures stem from aging or mishandling, others could indicate more serious quality issues or potential counterfeit threats

EARNINGS RECAP

This report summarizes the latest earnings results from the biggest brands in electronic components, highlighting key trends and financial insights.

AUTOMOTIVE

STMicroelectronics
• Revenue (midpoint): $2.71 billion (–16% YoY; +7.7% QoQ)
• Gross margin (guided): 33.4%

Bosch Group
• Revenue: €4.394 billion (Q2 2025)
• Operating Income: €519 million
(+19.6% QoQ)
• Net Income: €536.7 million
(+15.1% QoQ)

ON Semiconductor (Onsemi)
• Revenue range: $1.40–1.50 billion
(midpoint $1.45 billion) $0.45–$0.55
• GAAP EPS range: $0.45–0.55
• Non-GAAP EPS range: $0.48–0.58

The EV market is valued at $988.7B in 2025 and
projected to reach $2.53T by 2034, growing at an
11% CAGR. Asia Pacific leads, with BEVs,
passenger cars, and personal use dominating.
Notable future growth is expected in North
America, FCEVs, trucks, AWD systems, 100MPH
vehicles, commercial use, and mid-priced EVs.

Graph illustrating the Q1 2025 earnings recap of the automotive industry, highlighting revenue trends, profit margins, and performance comparisons across major manufacturers

Source: https://www.precedenceresearch.com/electric-vehicle-market

PRODUCT UPDATES

Integrated Circuits

Manufacturers like Intel, Samsung, and TSMC: are prioritizing advanced logic IC capacity expansions (28nm and below), driven by AI/data‑center demand; IC lead times have largely stabilized, though specialized ASICs and AI-targeted chips remain tighter.

Supply chain resilience efforts: including fab build-outs in the U.S. (boosted by CHIPS Act) are leading to logic IC lead times decreasing e.g., DDR3/DDR4 and NAND flash parts dropping from 26 weeks to around 10–15 weeks

FPGA

AMD (via Xilinx), Intel (Altera), NVIDIA: continue investing in embedded and adaptive SoCs; Xilinx’ high-end Versal and Intel’s Agilex families are seeing increased traction across 5G, automotive, and data-center applications.

Lead times & capacity focus: while general stabilization occurs, medium-density FPGAs face tighter supply for AI/edge use-cases; development cycles for mid-range parts are lengthening due to higher tooling complexity.

Passives

Manufacturers such as Murata, TDK, Yageo: continue shifting toward just-in-time production following 2023–24 corrections; general-purpose resistors, capacitors, and inductors see stable lead times around 8–12 weeks.

Selective tightness: high-voltage and IGBT capacitors from Infineon and similar vendors are experiencing extended lead times moving into Q3 2025 due to robust demand in automotive and industrial power-electronics..

MANUFACTURER UPDATES

SK Hynix

HBM Leadership and Tech Showcase: SK Hynix holds 70% of the HBM market and revealed its 12-layer HBM3E and HBM4 technologies at Computex and DTW 2025, targeting AI and mobile systems.

Nvidia

AI Valuation Milestone Achieved: Nvidia’s market cap rose to $3.76 trillion, surpassing Microsoft, reflecting dominance in AI GPU segments and strong investor confidence.

Samsung

HBM3E Qualification and Foundry Expansion: Samsung is preparing HBM4 and qualifying HBM3E with Nvidia, while accelerating 2nm foundry development to meet next-gen AI and computing performance needs.

Intel

Efficiency Strategy Post-CHIPS Act: Intel reduced CAPEX by 10% and announced workforce and leadership cuts after receiving $7.9B in CHIPS Act grants to streamline operations.

Customer Challenges – ASC Solutions
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For more news and industry insights dive into our Component Compass