MARKET REPORT Q1 2026

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Banner for ASC Global’s Q1 2026 Electronics Market Report highlighting memory and logic supply shifts: SK Hynix prioritizing HBM for AI, Samsung reallocating wafer capacity to premium HBM and DDR5, Micron selling out AI-optimized memory, and Intel advancing Meteor Lake and Nova Lake while managing legacy CPU node constraints.
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LEAD TIMES

We cover the current lead times and pricing trends for Analog, Power, Passive, Memory, Logic & Digital, and Electromechanical components.

Factory Lines

Open Market

Products Manufacturer LT Prognosis Pricing Availability Pricing
HBM SK Hynix 52+ icon arrow up icon arrow up icon arrow down icon arrow up
Samsung 52+ icon arrow up icon arrow up icon arrow down icon arrow up
IGBT’s STM 14-20 icon arrow up icon arrow double icon arrow double icon arrow double
Littelfuse 15-60 icon arrow double icon arrow double icon arrow double icon arrow double
Capacitors EATON 10-20 icon arrow down icon arrow double icon arrow double icon arrow double
Vishay 12-14 icon arrow double icon arrow double icon arrow double icon arrow double
Memory Modules Kingston 6-12 icon arrow up icon arrow up icon arrow down icon arrow up
ADATA 26-52 icon arrow up icon arrow up icon arrow down icon arrow up
8 Bit MCU Renesas 14-18 icon arrow double icon arrow double icon arrow double icon arrow double
NXP 16-39 icon arrow up icon arrow double icon arrow double icon arrow double
Relays Infineon 40-52 icon arrow double icon arrow up icon arrow double icon arrow up
TE Connectivity 12-14 icon arrow double icon arrow double icon arrow double icon arrow double

Factory Lines

Open Market

Products Manufacturer LT Prognosis Pricing Availability Pricing
HBM SK Hynix 52+ icon arrow up icon arrow up icon arrow down icon arrow up
Samsung 52+ icon arrow up icon arrow up icon arrow down icon arrow up
IGBT’s STM 14-20 icon arrow up icon arrow double icon arrow double icon arrow double
Littelfuse 15-60 icon arrow double icon arrow double icon arrow double icon arrow double
Capacitors EATON 10-20 icon arrow down icon arrow double icon arrow double icon arrow double
Vishay 12-14 icon arrow double icon arrow double icon arrow double icon arrow double
Memory Modules Kingston 6-12 icon arrow up icon arrow up icon arrow down icon arrow up
ADATA 26-52 icon arrow up icon arrow up icon arrow down icon arrow up
8 Bit MCU Renesas 14-18 icon arrow double icon arrow double icon arrow double icon arrow double
NXP 16-39 icon arrow up icon arrow double icon arrow double icon arrow double
Relays Infineon 40-52 icon arrow double icon arrow up icon arrow double icon arrow up
TE Connectivity 12-14 icon arrow double icon arrow double icon arrow double icon arrow double

END-OF-LIFE REPORTS

We highlight the EOL components from major brands, helping companies manage obsolescence and plan for replacements.

Manufacturer Part EOL Replacement
Analog Devices ADP2443 Jul 2026 ADI-recommended buck regulator alternatives
Infineon IR2110 Feb 2026 IRS2110S / newer gate drivers
Vishay BC327 Jan 2026 BC807 / newer small-signal BJTs
Texas Instruments TPS54560 Jan 2026 TPS54561 / newer TI buck regulators
NXP PCA9555 Jan 2026 PCA9535 / newer GPIO expanders
Renesas R5F100LGAFB Feb 2026 RL78/G23 MCU family
Manufacturer Part EOL Replacement
Analog Devices ADP2443 Jul 2026 ADI-recommended buck regulator alternatives
Infineon IR2110 Feb 2026 IRS2110S / newer gate drivers
Vishay BC327 Jan 2026 BC807 / newer small-signal BJTs
Texas Instruments TPS54560 Jan 2026 TPS54561 / newer TI buck regulators
NXP PCA9555 Jan 2026 PCA9535 / newer GPIO expanders
Renesas R5F100LGAFB Feb 2026 RL78/G23 MCU family

TEST & FAILURE RATES

In Q4 2025, diodes and transistors showed the highest failure rates, indicating stress in power and signal paths. MOSFETs followed, while FPGAs and logic ICs required ongoing validation. Memory, MCUs, RF, and power management devices recorded lower but persistent test exposure across industrial and communications systems.

By Device Type

Pie chart illustrating Q4 2025 component test exposure and failure rates: diodes and transistors represent the largest share, followed by MOSFETs; FPGAs and logic ICs show moderate exposure, while memory, MCUs, RF, and power management devices account for smaller but ongoing portions across industrial and communications systems.

Top 10 Component Types by Failure Rate

1. System on a Chip (SoC)
2. CPU
3. Module
4. Regulator
5. Synthesizer
6. Inductor
7. Relay
8. Converter
9. Bus
10. Clock Generator

 

This ranking is determined by the proportion of failed results compared to the total units tested in each category. While some failures stem from aging or mishandling, others could indicate more serious quality issues or potential counterfeit threats

EARNINGS RECAP

This report summarizes the latest earnings results from the biggest brands in electronic components, highlighting key trends and financial insights.

AUTOMOTIVE

General Motors

  • Revenue: $48.59 B (0.3% YoY)
  • Net income: $1.33 B
  • Net Profit Margin: 2.7%

Ford Motor Company

  • Revenue: $50.5 B (+9% YoY)
  • Net income: $2.4 B
  • Net Profit Margin: 4.8%

Toyota

  • Revenue: $93.1 B (+2.9% YoY)
  • Net income: $16.5 B
  • Net Profit Margin: 17.7%

PRODUCT UPDATES

Integrated Circuits

ICs from STMicroelectronics, Infineon, and TI face extended lead-times as production prioritizes AI and automotive segments; manufacturers are investing in capacity and advanced packaging to manage allocation and logistical pressures.

Legacy logic and MCU devices from NXP and Microchip are being reallocated to strategic customers, forcing distributors to secure longer delivery windows and prioritize forecasted orders.

FPGA

AMD/Xilinx FPGAs, especially automotive-grade and high-end devices, show severe allocation constraints with lead times of 40–52+ weeks; OEMs urged to secure inventory or design alternatives due to slow supply normalization.

Intel (Altera) FPGA availability remains constrained as foundry backlogs persist; sourcing strategies emphasize diversified channels and early forecasts for delivery commitments through mid-2026.

Passives

MLCC and tantalum capacitors from Panasonic, Murata, and Kemet are under allocation pressure with lead-times stretching over 20+ weeks in key profiles, leading OEMs to pre-order and secure slots.

Panasonic tantalum and specialty capacitors see 16–18 week waits, with upstream shortages of HVLP copper foil and fiberglass impacting broader PCB assembly timelines.

MANUFACTURER UPDATES

SK Hynix

SK Hynix is heavily prioritizing high-bandwidth memory production, allocating most advanced capacity to AI applications, effectively limiting availability for consumer memory and reinforcing supply tightness across PCs, smartphones, and storage devices.

Samsung

Samsung is redirecting wafer capacity toward premium HBM and enterprise DDR5, emphasizing profitability over volume, which constrains consumer memory supply and contributes to higher pricing pressure across global electronics markets.

Micron

Micron is focusing production on AI-optimized memory, selling out HBM capacity and leveraging strong margins, while reduced output of mainstream DRAM and NAND intensifies shortages for consumer and enterprise hardware manufacturers.

Intel

Intel is deploying advanced logic (Meteor Lake/Nova Lake) and expanding foundry services, with reported constraints in some legacy CPU nodes while responding to data-center logic demand.

Customer Challenges – ASC Solutions
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