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IPP083N10N5AKSA1
Category: MOSFETs, Single MOSFETsInfineon |
Infineon | OptiMOS™ 5 100V, Infineon’s latest generation of power MOSFETs, are especially designed for synchronous rectification in telecom and server power supplies. In addition, these devices can also be utilized in other industrial applications such as solar, low voltage drives and adapters. Within seven different packages, the new OptiMOS™ 5 100V MOSFETs offer the industry’s lowest R DS(on).
Packaging: RAL Supplier Type: Authorized Distributor | 19,000 available | | |
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IRF3205PBF
Category: MOSFETs, Single MOSFETsInfineon |
Infineon | Advanced HEXFET Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The TO-220 package is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.
Packaging: BLK Supplier Type: Authorized Distributor | 67,071 available | | | Qty | Price |
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| 1 | 1.9592 | | 10 | 1.6616 | | 100 | 1.2896 | | 500 | 1.09 | | 1,000 | 0.8878 |
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IRF7416TRPBF
Category: MOSFETs, Single MOSFETsInfineon |
Infineon | Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications. The SO-8 has been modified through a customized lead frame for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques. Power dissipation of greater than 0.8W is possible in a typical PCB mount application.
Packaging: TAP Supplier Type: Authorized Distributor | 644 available | | | Qty | Price |
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| 1 | 1.214 | | 10 | 1.0007 | | 25 | 0.9263 | | 50 | 0.8519 | | 100 | 0.7775 |
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