Last Updated: 6/9/26
SK hynix and NVIDIA Forge Multi-Year AI Memory Alliance
SK hynix and NVIDIA have signed a multi-year technology partnership to develop next-generation memory solutions for AI factories and global data centers. The agreement strengthens SK hynix’s position as NVIDIA’s leading memory supplier while supporting expanding AI workloads across supercomputers, robotics, personal AI, and cloud infrastructure. The collaboration aims to secure long-term memory supply amid persistent AI-driven semiconductor demand.
AMD Commits £2 Billion to Strengthen UK AI Ecosystem
AMD plans to invest up to £2 billion in the United Kingdom over the next five years to accelerate AI research, advanced computing, and workforce development. The initiative includes partnerships with universities, AI infrastructure projects, and next-generation computing programs, supporting the UK’s goal of expanding sovereign AI capabilities and strengthening its position as a global technology leader.
SK hynix Accelerates DRAM Expansion to Meet AI Demand
SK hynix is reportedly accelerating its Yongin semiconductor cluster expansion and plans to nearly double DRAM wafer capacity to approximately 1 million wafers per month by 2030. Driven by surging AI and HBM demand, the company aims to strengthen supply, support next-generation memory production, and maintain leadership in the rapidly growing AI infrastructure market.
onsemi Faces SiC Pressure Amid Planned Czech Workforce Reduction
onsemi is reportedly planning up to 300 job cuts at its Czech semiconductor facility as competition from lower-cost Chinese silicon carbide (SiC) suppliers intensifies. The restructuring reflects growing pricing pressure in the EV and power electronics markets, where Chinese manufacturers are rapidly expanding capacity and challenging established global SiC producers.
Infineon Repositions Tijuana Operations for Long-Term Manufacturing Efficiency
Infineon will gradually transfer backend production from its Tijuana, Mexico facility to other locations within its global manufacturing network over the coming years. The move aims to improve scalability, productivity, and long-term competitiveness while maintaining uninterrupted customer supply. The site’s wafer sawing, assembly, and testing operations will continue during the transition as future options for the facility are evaluated.
Google and NVIDIA Explore Intel as Strategic Manufacturing Backup
Google and NVIDIA are reportedly evaluating Intel as an alternative manufacturing partner as AI-driven demand strains global semiconductor capacity. Google has reportedly ordered more than three million AI Tensor Processing Units (TPUs) from Intel for 2028 production, while NVIDIA is assessing Intel’s packaging and process technologies for future designs. The move reflects growing efforts to diversify supply chains beyond TSMC, strengthen manufacturing resilience, and support expanding AI infrastructure demand.
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SK Group Reassesses SK Siltron Sale Amid AI Supply Growth
SK Group is reportedly reconsidering the sale of SK Siltron as the strategic value of semiconductor wafers rises within the AI chip supply chain. Growing demand for AI infrastructure has increased the importance of securing key semiconductor materials, prompting a review of whether retaining SK Siltron could provide greater long-term value than divestment.
Vishay Introduces Compact Power Module for 48V EV Systems
Vishay has launched the VS-HOT200C080, a 200A power module designed for 48V traction inverters in light electric vehicles and mild-hybrid systems. The solution reduces board space by up to 15% and lowers conduction losses by 32% through ultra-low-resistance MOSFETs. Its compact, automotive-qualified design supports improved efficiency, reliability, and power density in next-generation electrified vehicle platforms.
Infineon Unveils Industry-First 750V Bidirectional SiC Switch Solution
Infineon has introduced the industry’s first 750V silicon carbide bidirectional switch based on its CoolSiC™ G2 technology. Designed for solid-state circuit breakers, battery disconnects, and advanced power conversion systems, the device reduces conduction losses, improves efficiency, and simplifies system design. The innovation supports higher power density and reliability for electric vehicles, renewable energy, and industrial power applications.
ScioSense UFC23 Delivers Precision Smart Metering With Minimal Power
ScioSense has launched the UFC23, a fourth-generation ultrasonic flow converter designed for smart water, heat, and gas meters. The device combines high-precision flow measurement with ultra-low power consumption, featuring just 0.8µA standby current. Its CPU-free front-end architecture gives OEMs greater design flexibility while extending battery life and improving accuracy for next-generation smart metering and leak-detection applications.
Mouser Expands Access to TDK Automotive Transformer Solutions
Mouser Electronics is now offering TDK’s AMT45S automotive transformer, designed for high-voltage isolated power supplies in electric vehicles and industrial applications. The compact component delivers reinforced insulation, high efficiency, and reliable operation under demanding conditions. Its automotive-grade design supports advanced power conversion systems, helping engineers improve safety, power density, and overall system performance in next-generation electrified platforms.
Infineon and Siemens Advance Electrical Protection Using SiC Technology
Infineon and Siemens Smart Infrastructure have partnered to enhance electrical protection systems through silicon carbide (SiC) technology. By integrating Infineon’s CoolSiC™ devices into Siemens’ solid-state circuit breakers, the collaboration improves switching speed, energy efficiency, and system reliability. The solution supports smarter, more resilient power distribution networks for data centers, industrial facilities, and next-generation electrical infrastructure.
United States Quantum Package Directs Billions
SK hynix and NVIDIA Forge AI Memory Alliance
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